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Nts for the Degree Master of Science in Electrical Engineering by Srinidhi Raghavan Narasimhan Summer 2012 iii Copyright 2012 by Srinidhi Raghavan Narasimhan All Rights Reserved iv ABSTRACT OF THE THESIS High Frequency Signal Propagation in Through Silicon Vias by Srinidhi Raghavan Narasimhan Master of Science in Electrical Engineering San Diego State University, 2012 The 3D IC integration technology and silicon interposers rely on through silicon vias (TSVs) for vert.

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